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Electrical Characteristics (T
A
= 25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS
I S
Maximum Continuous Drain-Source Diode Forward Current
-2.5
A
V SD
Drain-Source Diode Forward Voltage
V GS = 0 V, I S = - 2.5 A
(Note 2)
- 0.85
-1.2
V
t rr
Reverse Recovery Time
V GS = 0 V, I F = - 2.5 A dI F /dt = 100 A/μs
140
ns
Notes:
1. P D ( t )
=
T J ? T A
R θ JA ( t )
=
T J ? T A
R θ JC + R θ CA ( t )
= I 2 D ( t ) × R DS ( ON ) @ T J
R θ JA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the
solder mounting surface of the drain pins. R θ JC is guaranteed by design while R θ CA is defined by users. For general reference: Applications on 4.5"x5" FR-4 PCB under still air environment,
typical R θ JA is found to be:
a. 42 o C when mounted on a 1 in 2 pad of 2oz copper.
b. 95 o C when mounted on a 0.066in 2 pad of 2oz copper.
c. 110 o C/W when mounted on a 0.00123in 2 pad of 2oz copper.
1a
1b
1c
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300μs, Duty Cycle < 2.0%.
NDT456P Rev. F
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